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product structure silicon monolithic integrated circuit this product has no designed protection against radioactive ra ys 1/ 19 tsz02201-0e3e0j500690-1-2 ? 20 15 rohm co., ltd. all rights reserved. 04.nov.2015 rev.001 tsz22111 ? 14 ? 001 www.rohm.com clock generator for audio/video equipment bu2363fv general description bu2363fv is a clock generator ic capable of generating three types of clocks - video, audio and system clocks that are necessary for dvd player systems. it is a single chip solution that uses pll technology. particularly, the video clock is a dvd-audio reference and yet achieves high c/n characteristics necessary to provide high definition images. features ? connecting a crystal oscillator generates multiple clock signals from a built-in pll circuit. ? the audio clock provides switching selection outpu ts ? the video clock achieves high c/n characteristics. ? single power supply of 3.3 v applications dvd players key specifications package w(typ) x d(typ) x h(max) typical application circuit (note) we believe that this circuit is to be recommended. however, to use it, make further thorough check for the characteristics. part name bu2363fv supply voltage range [v] 3.0 to 3.6 re ference frequency [mhz] 36.8640 output frequency [mhz] dvd video 2 54.0000 1 27.0000 dvd / cd audio (switching outputs) 768fs 36.8640 33.8688 384fs 18.4320 16.9344 system 768fs 33.8688 384fs 16.9344 jitter 1 [psec] 50 c/n [db] (video) - 80 operating temperature range [c] -10 to +70 open:enable 1:vdd2 16:oe l :disable 0.1uf 2:vss2 15:clk33m 33.8688mhz 54.0000mhz 3:clk254m 14:fsel open:48.0khz type l :44.1khz type 27.0000mhz 4:clk27m 13:clk16m 16.9344mhz 5:avdd 12:dvdd 0.1uf 0.1uf 6:avss 11:dvss 7:xtalin 10:768fs1 36.8640mhz or 33.8688mhz 8:xtalout 9:384fs2 18.4320mhz or 16.9344mhz bu2363fv 0.1f 0.1f 0.1f ssop-b 16 5.00mm x 6.40mm x 1. 35 mm datashee t datashee t downloaded from: http:///
b u2 363 fv 2/ 19 tsz02201-0e3e0j500690-1-2 ? 20 15 rohm co., ltd. all rights reserved. 04.nov.2015 rev.001 www.rohm.com tsz22111 ? 15 ? 001 pin configuration fsel clk768fs clk384fs l 33.8688mhz 16.9344mhz open 36.8640mhz 18.4320mhz pin descriptions (note) basically, mount ics to the printed circuit board for use. (i f the ics are not mounted to the printed circuit board, the chara cteristics of ics may not be fully demonstrated.) mount 0.1f capacitors in the vicinity of the ic pins between pin 1 (vdd2) and pin 2 (vss2), pin 5 (av dd ) and pin 6 (av ss ), pin 11 (dv ss ) and pin 12 (dv dd ), respectively. depending on the conditions of the printed circuit board, mount an additi onal electrolytic capacitor between the power supply and gnd terminal. for emi protection, it is effective to put ferrite beads in the origin of power to b e supplied to the bu2363fv from the board or to insert a capa citor (of not more than 1 ? ), which bypasses high frequency desired, between the power supply and the gnd. pin no. pin name pin function 1 vdd2 27mhz, 54mhz power supply 2 vss2 27mhz, 54mhzgnd 3 clk54m 54.0000mhz output 4 clk27m 27.0000mhz output 5 avdd analog power supply 6 avss analog gnd 7 xtalin crystal input terminal 8 xtalout crystal output terminal 9 384fs2 fsel=open:18.4320mhz, fsel=l:16.9344mhz 10 768fs1 fsel=open:36.8640mhz, fsel=l:33.8688mhz 11 dvss digital gnd 12 dvdd digital power supply 13 clk16m 16.9344mhz output 14 fsel pin 9, 10 output selection(with pull- up) open:18.4320mhz(pin 9), 36.8640mhz(pin 10 ) l:16.9344mhz(pin 9), 33.8688mhz(pin 10 ) 15 clk33m 33.8688mhz output 16 oe output enable (with pull-up) , open: enable, l: disable top view 1:vdd2 16:oe 2:vss2 15:clk33m 3:clk254m 14:fsel 4:clk27m 13:clk16m 5:avdd 12:dvdd 6:avss 11:dvss 7:xtalin 10:768fs1 8:xtalout 9:384fs2 bu2363fv downloaded from: http:///
b u2 363 fv 3/ 19 tsz02201-0e3e0j500690-1-2 ? 20 15 rohm co., ltd. all rights reserved. 04.nov.2015 rev.001 www.rohm.com tsz22111 ? 15 ? 001 block diagram absolute maximum ratings (ta=25 c ) parameter symbol rating unit supply voltage v dd -0.5 to 7.0 v in put voltage v in -0.5 to v dd 0.5 v storage temperature range tstg - 30 to 125 c power dissipation pd 0.45 (note 1) w (note 1) in the case of exceeding at ta = 25 c , 4.5mw should be reduced per 1 c (note) operating is not guaranteed. (note) power dissipation is measured when the ic is mounted to the printed circuit board. caution: operating the ic over the absolute maximum ratings may damage t he ic. the damage can either be a short circuit between pins or an open circuit between pins and the internal circuitry. therefore, it is important to consider circuit protection measures, such as adding a fuse, in case the ic is operated over the absolute maximum ratings. recommended operating conditions parameter symbol limit unit supply voltage v dd 3.0 to 3.6 v input h voltage v ih 0.8v dd to v dd v input l voltage v il 0.0 to 0.2v dd v operating temperature topr - 10 to 70 c maximum output load c l 15 pf xtal osc xtalin=36.8640mhz 1/8 1/4 multi-pll technology pll2 1/4 1/8 1/2 (fsel=open:36.8640mhz fsel=l :33.8688mhz) (fsel=open:18.4320mhz fsel=l :16.9344mhz) 7:xtalin 8:xtalout 3:clk54m 10:768fs1 16:oe 14:fsel (54.0000mhz) (fsel=open:48.0khz type fsel=l :44.1khz type) 4:clk27m (27.0000mhz) 15:clk33m (33.8688mhz) 13:clk16m (16.9344mhz) 9:384fs2 downloaded from: http:///
b u2 363 fv 4/ 19 tsz02201-0e3e0j500690-1-2 ? 20 15 rohm co., ltd. all rights reserved. 04.nov.2015 rev.001 www.rohm.com tsz22111 ? 15 ? 001 electrical characteristics (v dd =3.3v, ta=25 c , crystal frequency 36.8640mhz, unless otherwise specified.) parameter symbol min typ max unit conditions output l voltage v ol 0.4 v i ol =4.0ma output h voltage v oh 2.4 v i oh =-4.0ma consumption current i dd 30 50 ma at no load clk54m clk54m 54.0000 mhz x ta l x 375 / 64 / 4 clk27m clk27m 27.0000 mhz xtal x 375 / 64 / 8 clk33m clk33m 33.8688 mhz xtal x 147 / 40 / 4 clk16m clk16m 16.9344 mhz xtal x 147 / 40 / 8 clk768fs1 clk768_h 36.8640 mhz at fsel=open, xtal output clk768_l 33.8688 mhz at fsel=l, xtal x 147 / 40 / 4 clk384f s2 clk384_h 18.4320 mhz at fsel=open, xtal / 2 output clk384_l 16.9344 mhz at fsel=l, xtal x 147 / 40 / 8 duty duty 45 50 55 % measured at a voltage of 1/2 vdd period-jitter 1 p-j 1 50 psec (note 1) period-jitter min-max p-j min-max 30 0 psec (note 2) rise time t r 2.5 nsec period of transition time required for the clock output to reach 80% from 20% of vdd fall time t f 2.5 nsec period of transition time required for the clock output to reach 20% from 80% of vdd output lock-time t lock 1 msec (note 3) c/n 54m c/n 54m - 65 - 80 db (note 4) (at a maximum load) c/n 33m c/n 33m - 50 - 60 db (note 4) (at a maximum load) (note) the output frequency is determined by the arithmetic (freque ncy division) expression of a frequency input to xtalin. if the input frequency is set to 36.8640mhz, the output frequency will be as listed above. (note 1) period- jitter 1 this parameter represents standard deviation ( ? 1 ? ) on cycle distribution data at the time when the output clock cycles are sampled 1000 times consecutively with the tds7104 digital phosphor oscilloscope of tektronix japan, ltd. (note 2) period-jitter min-max this parameter represents a maximum distribution width on cycle distribution data at the time when the output clock cycles are sampled 1000 times consecutively with the tds7104 digital phosphor oscilloscope of tektronix japan, ltd. (note 3) output lock-time the lock-time represents elapsed time after power supply tu rns on to reach a 3.0v voltage, after the system is switched from power-down state to normal operation state, or after the output frequency is switched, until it is stabilized at a specified frequency, respectively. (note 4) make measurements with settings of span to 100khz, rbw to 1khz, and vbw to 100hz taking the middle point between (54 .0000mhz20khz) and (33.8688mhz20khz) as a measurement point. downloaded from: http:///
b u2 363 fv 5/ 19 tsz02201-0e3e0j500690-1-2 ? 20 15 rohm co., ltd. all rights reserved. 04.nov.2015 rev.001 www.rohm.com tsz22111 ? 15 ? 001 figure 2. 54mhz period-jitter (v dd =3.3v, at c l =15pf) 500psec/div 1.0v/div figure 3. 54mhz spectrum (v dd =3.3v, at c l =15pf) 10khz/div 10db /div rbw=1khz vbw=100hz figure 4. 27mhz output waveform (v dd =3.3v, at c l =15pf) 5.0nsec/div 1.0v/div figure 1. 54mhz output waveform (v dd =3.3v, at c l =15pf) 3.0nsec/div 1.0v/div typical performance curves (basic data) downloaded from: http:///
b u2 363 fv 6/ 19 tsz02201-0e3e0j500690-1-2 ? 20 15 rohm co., ltd. all rights reserved. 04.nov.2015 rev.001 www.rohm.com tsz22111 ? 15 ? 001 figure 6. 27mhz spectrum (v dd =3.3v, at c l =15pf) 10khz/div 10db /div rbw=1khz vbw=100hz figure 7. 33.9mhz output waveform (v dd =3.3v, at c l =15pf) 5.0nsec/div 1.0v/div figure 8. 33.9mhz period-jitter (v dd =3.3v, at c l =15pf) 500psec/div 1.0v/div typical performance curves C continued figure 5. 27mhz period-jitter (v dd =3.3v, at c l =15pf) 500psec/div 1.0v/div downloaded from: http:///
b u2 363 fv 7/ 19 tsz02201-0e3e0j500690-1-2 ? 20 15 rohm co., ltd. all rights reserved. 04.nov.2015 rev.001 www.rohm.com tsz22111 ? 15 ? 001 figure 10. 16.9mhz output waveform (v dd =3.3v, at c l =15pf) 10.0nsec/div 1.0v/div figure 11. 16.9mhz period-jitter (v dd =3.3v, at c l =15pf) 500psec/div 1.0v/div figure 12. 16.9mhz spectrum (v dd =3.3v, at c l =15pf) 10khz/div 10db /div rbw=1khz vbw=100hz typical performance curves C continued figure 9. 33.9mhz spectrum (v dd =3.3v, at c l =15pf) 10khz/div 10db div rbw=1khz vbw=100hz downloaded from: http:///
b u2 363 fv 8/ 19 tsz02201-0e3e0j500690-1-2 ? 20 15 rohm co., ltd. all rights reserved. 04.nov.2015 rev.001 www.rohm.com tsz22111 ? 15 ? 001 figure 15. 36.9mhz spectrum (v dd =3.3v, at c l =15pf) 10khz/div 10db /div rbw=1khz vbw=100hz figure 16. 18.4mhz output waveform (v dd =3.3v, at c l =15pf) 10.0nsec/div 1.0v/div figure 14. 36.9mhz period-jitter (v dd =3.3v, at c l =15pf) 500psec/div 1.0v/div typical performance curves C continued figure 13. 36.9mhz output waveform (v dd =3.3v, at c l =15pf) 5.0nsec/div 1.0v/div downloaded from: http:///
b u2 363 fv 9/ 19 tsz02201-0e3e0j500690-1-2 ? 20 15 rohm co., ltd. all rights reserved. 04.nov.2015 rev.001 www.rohm.com tsz22111 ? 15 ? 001 figure 18. 18.4mhz spectrum (v dd =3.3v, at c l =15pf) 10khz div 10db /div rbw=1khz vbw=100hz typical performance curves C continued figure 17. 18.4mhz period-jitter (v dd =3.3v, at c l =15pf) 500psec div 1.0v/div downloaded from: http:///
b u2 363 fv 10 / 19 tsz02201-0e3e0j500690-1-2 ? 20 15 rohm co., ltd. all rights reserved. 04.nov.2015 rev.001 www.rohm.com tsz22111 ? 15 ? 001 0 100 200 300 400 500 600 -25 0 25 50 75 100 temperature t[ ] p erio d-ji tte rmin-ma x p j-min-ma x [p sec] v dd =2.9v v dd =3.3v v dd =3.7v typical performance curves C continued (temperature and supply voltage variations data) figure 19. duty vs temperature (54mhz) 45 46 47 48 49 50 51 52 53 54 55 -25 0 25 50 75 100 temperature t[ ] duty duty[%] v dd =2.9v v dd =3.3v v dd =3.7v temperature : ta [c] duty : duty [%] figure 20. period- jitter 1 vs temperature (54mhz) 0 10 20 30 40 50 60 70 80 90 100 -25 0 25 50 75 100 temperature t[ ] p erio d-ji tte r1 p j-1 [psec] v dd =2.9v v dd =3.3v v dd =3.7v temperature : ta [c] period-jitter 1 : pj - 1 [psec] figure 22. duty vs temperature (27mhz) 45 46 47 48 49 50 51 52 53 54 55 -25 0 25 50 75 100 temperature t[ ] duty duty[%] v dd =2.9v v dd =3.3v v dd =3.7v temperature : ta [c] duty : duty [%] temperature : ta [c] period-jitter min-max : pj-min-max [psec] figure 21. period-jitter min-max vs temperature (54mhz) downloaded from: http:///
b u2 363 fv 11 / 19 tsz02201-0e3e0j500690-1-2 ? 20 15 rohm co., ltd. all rights reserved. 04.nov.2015 rev.001 www.rohm.com tsz22111 ? 15 ? 001 0 100 200 300 400 500 600 -25 0 25 50 75 100 temperature t[ ] p erio d-ji tte rmin-ma x p j-min-ma x [p sec] v dd =2.9v v dd =3.3v v dd =3.7v 45 46 47 48 49 50 51 52 53 54 55 -25 0 25 50 75 100 temperature t[ ] duty duty[% ] v dd =2.9v v dd =3.3v v dd =3.7v 0 10 20 30 40 50 60 70 80 90 100 -25 0 25 50 75 100 temperature t[ ] p erio d-ji tte r1 p j-1 [psec] v dd =3.3v v dd =2.9v v dd =3.7v typical performance curves C continued figure 23. period- jitter 1 vs temperature (27mhz) 0 10 20 30 40 50 60 70 80 90 100 -25 0 25 50 75 100 temperature t[ ] p erio d-ji tte r1 p j-1 [psec] v dd =3.3v v dd =2.9v v dd =3.7v temperature : ta [c] period-jitter 1 : pj - 1 [psec] temperature : ta [c] period-jitter min-max : pj-min-max [psec] figure 24. period-jitter min-max vs temperature (27mhz) temperature : ta [c] duty : duty [%] figure 25. duty vs temperature (33.9mhz) temperature : ta [c] period-jitter 1 : pj - 1 [psec] figure 26. period- jitter 1 vs temperature (33.9mhz) downloaded from: http:///
b u2 363 fv 12 / 19 tsz02201-0e3e0j500690-1-2 ? 20 15 rohm co., ltd. all rights reserved. 04.nov.2015 rev.001 www.rohm.com tsz22111 ? 15 ? 001 figure 28. duty vs temperature (16.9mhz) 45 46 47 48 49 50 51 52 53 54 55 -25 0 25 50 75 100 temperature t[ ] duty duty[%] v dd =2.9v v dd =3.3v v dd =3.7v 0 10 20 30 40 50 60 70 80 90 100 -25 0 25 50 75 100 temperature t[ ] p erio d-ji tte r1 p j-1 [psec] v dd =2.9v v dd =3.3v v dd =3.7v 0 100 200 300 400 500 600 -25 0 25 50 75 100 temperature t[ ] p erio d-ji tte rmin-ma x p j-min-ma x [p sec] v dd =2.9v v dd =3.3v v dd =3.7v typical performance curves C continued temperature : ta [c] duty : duty [%] figure 27. period-jitter min-max vs temperature (33.9mhz) 0 100 200 300 400 500 600 -25 0 25 50 75 100 temperature t[ ] p erio d-ji tte rmin-ma x p j-min-ma x [p sec] v dd =2.9v v dd =3.3v v dd =3.7v temperature : ta [c] period-jitter min-max : pj-min-max [psec] temperature : ta [c] period-jitter 1 : pj - 1 [psec] figure 29. period- jitter 1 vs temperature (16.9mhz) temperature : ta [c] period-jitter min-max : pj-min-max [psec] figure 30. period-jitter min-max vs temperature (16.9mhz) downloaded from: http:///
b u2 363 fv 13 / 19 tsz02201-0e3e0j500690-1-2 ? 20 15 rohm co., ltd. all rights reserved. 04.nov.2015 rev.001 www.rohm.com tsz22111 ? 15 ? 001 0 10 20 30 40 50 60 70 80 90 100 -25 0 25 50 75 100 temperature t[ ] p erio d-ji tte r1 p j-1 [psec] v dd =2.9v v dd =3.3v v dd =3.7v 0 100 200 300 400 500 600 -25 0 25 50 75 100 temperature t[ ] p erio d-ji tte rmin-ma x p j-min-ma x [p sec] v dd =3.3v v dd =2.9v v dd =3.7v typical performance curves C continued figure 31. duty vs temperature (36.9mhz) 45 46 47 48 49 50 51 52 53 54 55 -25 0 25 50 75 100 temperature t[ ] duty duty[%] v dd =2.9v v dd =3.3v v dd =3.7v temperature : ta [c] duty : duty [%] figure 34. duty vs temperature (18.4mhz) 45 46 47 48 49 50 51 52 53 54 55 -25 0 25 50 75 100 temperature t[ ] duty duty[%] v dd =2.9v v dd =3.3v v dd =3.7v temperature : ta [c] duty : duty [%] temperature : ta [c] period-jitter 1 : pj - 1 [psec] figure 32. period- jitter 1 vs temperature (36.9mhz) temperature : ta [c] period-jitter min-max : pj-min-max [psec] figure 33. period-jitter min-max vs temperature (36.9mhz) downloaded from: http:///
b u2 363 fv 14 / 19 tsz02201-0e3e0j500690-1-2 ? 20 15 rohm co., ltd. all rights reserved. 04.nov.2015 rev.001 www.rohm.com tsz22111 ? 15 ? 001 typical performance curves C continued figure 35. period- jitter 1 vs temperature (18.4mhz) 0 10 20 30 40 50 60 70 80 90 100 -25 0 25 50 75 100 temperature t[ ] p erio d-ji tte r1 p j-1 [psec] v dd =2.9v v dd =3.3v v dd =3.7v temperature : ta [c] period-jitter 1 : pj - 1 [psec] figure 37. consumption current vs temperature consumption current (with maximum output load) 0 10 20 30 40 50 -25 0 25 50 75 100 temperature t[ ] circui t current idd[ma] v dd =2.9v v dd =3.3v v dd =3.7v temperature : ta [c] circuit current : i dd [ma] 0 100 200 300 400 500 600 -25 0 25 50 75 100 temperature t[ ] p erio d-ji tte rmin-ma x p j-min-ma x [p sec] v dd =3.3v v dd =2.9v v dd =3.7v temperature : ta [c] period-jitter min-max : pj-min-max [psec] figure 36. period-jitter min-max vs temperature (18.4mhz) downloaded from: http:///
b u2 363 fv 15 / 19 tsz02201-0e3e0j500690-1-2 ? 20 15 rohm co., ltd. all rights reserved. 04.nov.2015 rev.001 www.rohm.com tsz22111 ? 15 ? 001 operational notes 1. reverse connection of power supply connecting the power supply in reverse polarity can damage the ic. take precautions against reverse polarity when connecting the power supply, such as mounting an extern al diode between the power supply and the ic s power supply pin s. 2. power supply lines design the pcb layout pattern to provide low impedance sup ply lines. separate the ground and supply lines of the digital and analog blocks to prevent noise in the groun d and supply lines of the digital block from affecting the a nalog block. furthermore, connect a capacitor to ground at all pow er supply pins . consider the effect of temperature and aging on the capacitance value when using electrolytic capac itors. 3. ground voltage ensure that no pins are at a voltage below that of the ground pin a t any time, even during transient condition. 4. ground wiring pattern when using both small-signal and large-current ground trace s, the two ground traces should be routed separately but connected to a single ground at the reference point of the a pplication board to avoid fluctuations in the small-si gnal ground caused by large currents. also ensure that the ground traces of external components do not cause variations on the ground voltage. the ground lines must be as short and th ick as possible to reduce line impedance. 5. thermal consideration should by any chance the power dissipation rating be exc eeded the rise in temperature of the chip may result in deterioration of the properties of the chip. in case of exceeding thi s absolute maximum rating, increase the board size and copper area to prevent exceeding the pd rating. 6. recommended operating conditions these conditions represent a range within which the expec ted characteristics of the ic can be approximately obtained . the electrical characteristics are guaranteed under the condi tions of each parameter. 7. in rush current when power is first supplied to the ic, it is possible that the internal logic may be unstable and inrush current may flow instantaneously due to the internal powering sequence a nd delays, especially if the ic has more than one power supply. therefore, give special consideration to power coup ling capacitance, power wiring, width of ground wiring, and routing of connections. 8. operation under strong electromagnetic field operating the ic in the presence of a strong electromagnetic field m ay cause the ic to malfunction. 9. testing on application boards when testing the ic on an application board, connecting a capacitor directly to a low-impedance output pin may subject the ic to stress. always discharge capacitors compl etely after each process or ste p. the ics power supply should always be turned off completely before connecting or removing it from the test setup during the inspection process. to prevent damage from static discharge, ground the ic during assembly and use similar precautions during tr ansport and storage. 10. inter-pin short and mounting errors ensure that the direction and position are correct when mounti ng the ic on the pcb. incorrect mounting may result in damaging the ic. avoid nearby pins being shorted to each other especially to grou nd , power supply and output pin . inter-pin shorts could be due to many reasons such as m etal particles, water droplets (in very humid environment) and unintentional solder bridge deposited in between pins during assembly to name a few. 11. unused input pins input pins of an ic are often connected to the gate of a mos tra nsistor. the gate has extremely high impedance and extremely low capacitance. if left unconnected, the electric field from the outside can easily charge it. the small ch arge acquired in this way is enough to produce a significant e ffect on the conduction through the transistor and cause unexpected operation of the ic. so unless otherwise specifie d, unused input pins should be connected to the power supply or ground line. downloaded from: http:///
b u2 363 fv 16 / 19 tsz02201-0e3e0j500690-1-2 ? 20 15 rohm co., ltd. all rights reserved. 04.nov.2015 rev.001 www.rohm.com tsz22111 ? 15 ? 001 operational notes C co ntinued 12. regarding the input pin of the ic in the construction of this ic, p-n junctions are inevitably fo rmed creating parasitic diodes or transistors. the operati on of these parasitic elements can result in mutual interference among circuits, operational faults, or physical damage. therefore, conditions which cause these parasitic element s to operate, such as applying a voltage to an input pin lower than the ground voltage should be avoided. furtherm ore, do not apply a voltage to the input pins when no power supply voltage is applied to the ic. even if the power supp ly voltage is applied, make sure that the input pins hav e voltages within the values specified in the electrical characte ristics of this ic. 13. ceramic capacitor when using a ceramic capacitor, determine the dielectric constant considering the change of capacitance with temperature and the decrease in nominal capacitance due to dc bia s and others. downloaded from: http:///
b u2 363 fv 17 / 19 tsz02201-0e3e0j500690-1-2 ? 20 15 rohm co., ltd. all rights reserved. 04.nov.2015 rev.001 www.rohm.com tsz22111 ? 15 ? 001 ordering information b u 2 3 6 3 f v - e 2 part number package fv: ssop-b16 package and forming specification e2: reel-like emboss taping marking diagram ssop-b16(top view) 2363f part number marking lot number 1pin mark downloaded from: http:///
b u2 363 fv 18 / 19 tsz02201-0e3e0j500690-1-2 ? 20 15 rohm co., ltd. all rights reserved. 04.nov.2015 rev.001 www.rohm.com tsz22111 ? 15 ? 001 physical dimension, tape and reel information package name ssop-b16 downloaded from: http:///
b u2 363 fv 19 / 19 tsz02201-0e3e0j500690-1-2 ? 20 15 rohm co., ltd. all rights reserved. 04.nov.2015 rev.001 www.rohm.com tsz22111 ? 15 ? 001 revision history date revision changes 04.nov.2015 001 new release downloaded from: http:///
datasheet d a t a s h e e t notice-pga-e rev.00 2 ? 2015 rohm co., ltd. all rights reserved. notice precaution on using rohm products 1. our products are designed and manufac tured for application in ordinary elec tronic equipments (such as av equipment, oa equipment, telecommunication equipment, home electroni c appliances, amusement equipment, etc.). if you intend to use our products in devices requiring ex tremely high reliability (such as medical equipment (note 1) , transport equipment, traffic equipment, aircraft/spacecra ft, nuclear power controllers, fuel c ontrollers, car equipment including car accessories, safety devices, etc.) and whose malfunction or failure may cause loss of human life, bodily injury or serious damage to property (?specific applications?), please consult with the rohm sale s representative in advance. unless otherwise agreed in writing by rohm in advance, rohm shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of any ro hm?s products for specific applications. (note1) medical equipment classification of the specific applications japan usa eu china class class class b class class ? class 2. rohm designs and manufactures its products subject to strict quality control system. however, semiconductor products can fail or malfunction at a certain rate. please be sure to implement, at your own responsibilities, adequate safety measures including but not limited to fail-safe desi gn against the physical injury, damage to any property, which a failure or malfunction of our products may cause. the following are examples of safety measures: [a] installation of protection circuits or other protective devices to improve system safety [b] installation of redundant circuits to reduce the impact of single or multiple circuit failure 3. our products are designed and manufactured for use under standard conditions and not under any special or extraordinary environments or conditio ns, as exemplified below. accordin gly, rohm shall not be in any way responsible or liable for any damages, expenses or losses arising from the use of an y rohm?s products under any special or extraordinary environments or conditions. if you intend to use our products under any special or extraordinary environments or conditions (as exemplified below), your independent verification and confirmation of product performance, reliability, etc, prior to use, must be necessary: [a] use of our products in any types of liquid, incl uding water, oils, chemicals, and organic solvents [b] use of our products outdoors or in places where the products are exposed to direct sunlight or dust [c] use of our products in places where the products ar e exposed to sea wind or corrosive gases, including cl 2 , h 2 s, nh 3 , so 2 , and no 2 [d] use of our products in places where the products are exposed to static electricity or electromagnetic waves [e] use of our products in proximity to heat-producing components, plastic cords, or other flammable items [f] sealing or coating our products with resin or other coating materials [g] use of our products without cleaning residue of flux (ev en if you use no-clean type fluxes, cleaning residue of flux is recommended); or washing our products by using water or water-soluble cleaning agents for cleaning residue after soldering [h] use of the products in places subject to dew condensation 4. the products are not subjec t to radiation-proof design. 5. please verify and confirm characteristics of the final or mounted products in using the products. 6. in particular, if a transient load (a large amount of load applied in a short per iod of time, such as pulse. is applied, confirmation of performance characteristics after on-boar d mounting is strongly recomm ended. avoid applying power exceeding normal rated power; exceeding the power rating under steady-state loading c ondition may negatively affect product performance and reliability. 7. de-rate power dissipation depending on ambient temperature. when used in sealed area, c onfirm that it is the use in the range that does not exceed t he maximum junction temperature. 8. confirm that operation temperat ure is within the specified range described in the product specification. 9. rohm shall not be in any way responsible or liable for fa ilure induced under deviant condi tion from what is defined in this document. precaution for mounting / circuit board design 1. when a highly active halogenous (chlori ne, bromine, etc.) flux is used, the resi due of flux may negatively affect product performance and reliability. 2. in principle, the reflow soldering method must be used on a surface-mount products, the flow soldering method must be used on a through hole mount products. if the flow sol dering method is preferred on a surface-mount products, please consult with the rohm representative in advance. for details, please refer to rohm mounting specification downloaded from: http:///
datasheet d a t a s h e e t notice-pga-e rev.00 2 ? 2015 rohm co., ltd. all rights reserved. precautions regarding application examples and external circuits 1. if change is made to the constant of an external circuit, pl ease allow a sufficient margin considering variations of the characteristics of the products and external components, including transient characteri stics, as well as static characteristics. 2. you agree that application notes, re ference designs, and associated data and in formation contained in this document are presented only as guidance for products use. theref ore, in case you use such information, you are solely responsible for it and you must exercise your own indepen dent verification and judgment in the use of such information contained in this document. rohm shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of such information. precaution for electrostatic this product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. please take proper caution in your manufacturing process and storage so that voltage exceeding t he products maximum rating will not be applied to products. please take special care under dry condit ion (e.g. grounding of human body / equipment / solder iron, isolation from charged objects, se tting of ionizer, friction prevention and temperature / humidity control). precaution for storage / transportation 1. product performance and soldered connections may deteriora te if the products are stor ed in the places where: [a] the products are exposed to sea winds or corros ive gases, including cl2, h2s, nh3, so2, and no2 [b] the temperature or humidity exceeds those recommended by rohm [c] the products are exposed to di rect sunshine or condensation [d] the products are exposed to high electrostatic 2. even under rohm recommended storage c ondition, solderability of products out of recommended storage time period may be degraded. it is strongly recommended to confirm sol derability before using products of which storage time is exceeding the recommended storage time period. 3. store / transport cartons in the co rrect direction, which is indicated on a carton with a symbol. otherwise bent leads may occur due to excessive stress applied when dropping of a carton. 4. use products within the specified time after opening a humidity barrier bag. baking is required before using products of which storage time is exceeding the recommended storage time period. precaution for product label qr code printed on rohm products label is for rohm?s internal use only. precaution for disposition when disposing products please dispose them proper ly using an authorized industry waste company. precaution for foreign exchange and foreign trade act since concerned goods might be fallen under listed items of export control prescribed by foreign exchange and foreign trade act, please consult with rohm in case of export. precaution regarding intellectual property rights 1. all information and data including but not limited to application example contained in this document is for reference only. rohm does not warrant that foregoi ng information or data will not infringe any intellectual property rights or any other rights of any third party regarding such information or data. 2. rohm shall not have any obligations where the claims, actions or demands arising from the co mbination of the products with other articles such as components, circuits, systems or external equipment (including software). 3. no license, expressly or implied, is granted hereby under any intellectual property rights or other rights of rohm or any third parties with respect to the products or the informati on contained in this document. pr ovided, however, that rohm will not assert its intellectual property rights or other rights against you or your customers to the extent necessary to manufacture or sell products containing the produc ts, subject to the terms and conditions herein. other precaution 1. this document may not be reprinted or reproduced, in whol e or in part, without prior written consent of rohm. 2. the products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written consent of rohm. 3. in no event shall you use in any wa y whatsoever the products and the related technical information contained in the products or this document for any military purposes, incl uding but not limited to, the development of mass-destruction weapons. 4. the proper names of companies or products described in this document are trademarks or registered trademarks of rohm, its affiliated companies or third parties. downloaded from: http:///
datasheet datasheet notice ? we rev.001 ? 201 5 rohm co., ltd. all rights reserved. general precaution 1. before you use our pro ducts, you are requested to care fully read this document and fully understand its contents. rohm shall n ot be in an y way responsible or liabl e for fa ilure, malfunction or acci dent arising from the use of a ny rohms products against warning, caution or note contained in this document. 2. all information contained in this docume nt is current as of the issuing date and subj ec t to change without any prior notice. before purchasing or using rohms products, please confirm the la test information with a rohm sale s representative. 3. the information contained in this doc ument is provi ded on an as is basis and rohm does not warrant that all information contained in this document is accurate an d/or error-free. rohm shall not be in an y way responsible or liable for an y damages, expenses or losses incurred b y you or third parties resulting from inaccur acy or errors of or concerning such information. downloaded from: http:///

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